Author: Nauman Khan
Edition: 2013
Binding: Kindle Edition
ISBN: B00BLQHR7Q
Edition: 2013
Binding: Kindle Edition
ISBN: B00BLQHR7Q
Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. Get Designing TSVs for 3D Integrated Circuits computer books for free.
It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.A Since TSVs occupy silicon real-estate and impact device density, Check Designing TSVs for 3D Integrated Circuits our best computer books for 2013. All books are available in pdf format and downloadable from rapidshare, 4shared, and mediafire.

Designing TSVs for 3D Integrated Circuits Free
A Since TSVs occupy silicon real-estate and impact device density,