Three-dimensional Integrated Circuit Design

Author: Visileios F. Pavlidis
Edition: 1
Binding: Kindle Edition
ISBN: B0048EJXOS

Three-dimensional Integrated Circuit Design (Systems on Silicon)

With vastly increased complexity and functionality in the "nanometer era" (i. Get Three-dimensional Integrated Circuit Design computer books for free.
. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.

Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to enhance dramatically chip performance and functionality, while reducing the distance among devices on a chip. They promise solutions to the current "interconnect bottleneck" challenges faced by IC designers. They also Check Three-dimensional Integrated Circuit Design our best computer books for 2013. All books are available in pdf format and downloadable from rapidshare, 4shared, and mediafire.

Three-dimensional Integrated Circuit Design Free

. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.

Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to enhance dramatically chip performance and functionality, while reducing the distance among devices on a chip They also

Related Computer Books

Three Dimensional System Integration: IC Stacking Process and Design

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume).