Author: Sung Kyu Lim
Edition: 2012
Binding: Hardcover
ISBN: 1441995412
Edition: 2012
Binding: Hardcover
ISBN: 1441995412
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. Get Design for High Performance, Low Power computer books for free.
It describes numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability Check Design for High Performance, Low Power our best computer books for 2013. All books are available in pdf format and downloadable from rapidshare, 4shared, and mediafire.

Design for High Performance, Low Power Free
This book will also offer various design-for-manufacturability (DFM), design-for-reliability
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